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Products » Adhesives »
Jet Melt
Jet Melt Hot Melt Adhesive
Jet-melt Adhesive Bonding Systems have been specifically developed to provide a
versatile and convenient method of joining a wide range of substrates used in
manufacturing. Jet-melt Adhesives are solvent-free thermoplastic resins
that become liquid when heated. They are applied in their molten state
and, upon cooling, immediately form a strong bond to most surfaces including
wood, plastic, foam, fabric, expanded polystyrene foam and cardboard.
Hot Melt Adhesive Systems - Selection Chart
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LOW MELT TECHNOLOGY: Applied at only 130°C, these Jet-melt 'LM'
adhesives can bond many heat sensitive substrates such as polystyrene foam.
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3762LM
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Improved "hot-tack" when dispensed at low melt
temperature.
Can bond expanded polystyrene, corrugated packaging, displays.
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Light Tan
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LT
EC
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55°C
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3778LM
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Can bond many wood and wood-like products, as well as many plastics
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Light Tan
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LT
EC
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55°C
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3792LM
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Long bonding range when dispensed at low melt temperature.
Can bond woods, P.O.S. displays, corrugated packaging, polyolefins, and other
lightweight materials.
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Clear
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LT
EC
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60°C
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HOT MELT TECHNOLOGY
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3738
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High delivery and long bonding range.
General purpose for foundry sand cores, exhibits, wood bonding, corrugated, and
chipboard.
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Medium Tan
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TC
TCQ
EC
PG2
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55°C
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3747
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General purpose including plastic and wood.
Good heat resistance and flexibility. Medium performance. Can bond
light gauge metal.
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Light Amber
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TC
TCQ
EC
PG2
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65°C
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3748
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Good thermal and electrical properties.
Non-corrosive to copper. Can bond polypropylene, polyethylene.
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Off-White
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TC
TCQ
EC
PG2
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80°C
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3748V-O
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Self-extinguishing version of 3748 adhesive, meets UL 94 V-O, UL1410
requirements. Can bond FRP epoxy board, polypropylene.
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Pale Yellow
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TCQ
EC
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80°C
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3762
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Excellent "hot-tack", fast setting for corrugated packaging, repacking
area. Low cost, general purpose. Can bond chipboard, wood.
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Medium Tan
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TC
TCQ
EC
PG2
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55°C
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3764
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Can bond many plastics. Good impact resistance at low temperature.
Can bond ABS, polycarbonate, rigid PVC, polypropylene, polyethylene.
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Clear
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TC
TCQ
EC
PG2
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60°C
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3779
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Good electrical properties with high heat resistance for potting, wire staking,
UL 94 V-O. Good fuel and oil resistance.
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Translucent, Light Amber
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TC
TCQ
EC
PG2
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150°C
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3789
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High performance for plastic.
Impact resistant. Can bond wood, vinyl, ABS, FRP.
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Translucent, Amber
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TCQ
EC
PG2
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105°C
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3792
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Clear multi-purpose product for wood, corrugated packaging, lightweight
substrates. Furniture, upholstery, novelties. Can bond fabric and
other lightweight materials.
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Clear
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TC
TCQ
EC
PG2
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60°C
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3796
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Multi-purpose with heat resistance.
High performance for plastics and light gauge materials.
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Tan
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TC
PG2
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100°C
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(a)
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TC = Touch Control Applicator
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(15 x 48 mm mini sticks)
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TCQ = TC Quadrack™ Applicator
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(15 x 200 mm Quadrack Hot Melt sticks)
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LT = Polygun LT Applicator
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(15 x 200 mm Quadrack Low Melt sticks)
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EC = Polygun EC Applicator
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(15 x 200 mm Quadrack sticks, Low Melt + Hot Melt)
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PG2 = Polygun 2 Applicator
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(26 x 76 mm slugs)
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(b)
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Highest temperature with strength 25mm OLS Douglas Fir 2 PSI (13.79 kPa) dead
load; temperature is raised 5.5°C every 30 minutes. Temperature
recorded is last bondline temperature with strength.
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